Method to remove spacer after salicidation to enhance contact etch stop liner stress on mos

ABSTRACT

An example process to remove spacers from the gate of a NMOS transistor. A stress creating layer is formed over the NMOS and PMOS transistors and the substrate. In an embodiment, the spacers on gate are removed so that stress layer is closer to the channel of the device. The stress creating layer is preferably a tensile nitride layer. The stress creating layer is preferably a contact etch stop liner layer. In an embodiment, the gates, source and drain region have a silicide layer thereover before the stress creating layer is formed. The embodiment improves the performance of the NMOS transistors.

BACKGROUND OF THE INVENTION

1) Field of the Invention

This invention relates generally to structures and method forfabricating semiconductor devices and more particularly structures andmethod for inducing stresses of different areas of a substrate.

2) Description of the Prior Art

As semiconductor device switching speeds continue to increase andoperating voltage levels continue to decrease, the performance of MOSand other types of transistors needs to be correspondingly improved. Thecarrier mobility in a MOS transistor has a significant impact on powerconsumption and switching performance, where improvement in carriermobility allows faster switching speeds. The carrier mobility is ameasure of the average speed of a carrier (e.g., holes or electrons) ina given semiconductor, given by the average drift velocity of thecarrier per unit electric field. Improving carrier mobility can improvethe switching speed of a MOS transistor, as well as allow operation atlower voltages.

One way of improving carrier mobility involves reducing the channellength and gate dielectric thickness in order to improve current driveand switching performance. However, this approach may increase gatetunneling current, which in turn degrades the performance of the deviceby increasing off state leakage. In addition, decreasing gate lengthgenerally calls for more complicated and costly lithography processingmethods and systems.

The importance of overcoming the various deficiencies is evidenced bythe extensive technological development directed to the subject, asdocumented by the relevant patent and technical literature. The closestand apparently more relevant technical developments in the patentliterature can be gleaned by considering the following.

US 20040262784 High performance CMOS device structures and method ofmanufacture—A semiconductor device structure includes at least two fieldeffect transistors formed on same substrate, the first field effecttransistor includes a spacer having a first width, the second fieldeffect transistor includes a compressive spacer having a second width,the first width being different than said second width. Preferably, thefirst width is narrower than the second width. A tensile stressdielectric film forms a barrier etch stop layer over the transistors.Inventors: Bruce B. Doris, et al.

U.S. Pat. No. 6,825,529: and US 20040113217A1: Stress inducingspacers—Spacer structure for semiconductor devices formed in substrate,has two spacer structures, each comprising stress inducing materialadjacent to both sidewall of one of device's gate terminal and itschannel which applies mechanical stress—Inventor: Chidambarrao

US20040104405A1: Novel CMOS device—Improving mobility of holes andelectrons within semiconductor device structure, involves forming firstand second stress layers over p- and n-type metal oxide semiconductordevice respectively—Inventor: Huang

U.S. Pat. No. 6,573,172: Methods for improving carrier mobility of PMOSand NMOS devices—Fabrication of semiconductor device by formingP-channel and N-channel metal oxide semiconductor transistors in wafer,forming tensile film on P-channel transistor and forming compressivefilm on N-channel transistor—Inventor: En, et al.

US20030040158A1: Semiconductor device and method of fabricating thesame—Semiconductor device includes first nitride layer containingtensile stress and second nitride layer containing compressivestress—Inventor: Saitoh, Takehiro

Thus, there remains a need for methods by which the carrier mobility ofboth NMOS and PMOS transistors may be improved so as to facilitateimproved switching speed and low-power, low-voltage operation of CMOSdevices, without significantly adding to the cost or complexity of themanufacturing process.

SUMMARY OF THE INVENTION

The embodiments of the present invention provides a structure and amethod of manufacturing a FET device without spacer and with anoverlying stress layer improves device performance which ischaracterized as follows.

An example embodiment of the invention is a method of fabricationsemiconductor device; comprising the steps of:

-   -   providing a substrate having a first region and a second region;    -   providing a first gate, first source/drain regions in said first        region; a first channel region in said first region under said        first gate; providing a second gate, second spacers on the        second gate sidewalls; second source/drain regions in said        second region adjacent to said second spacers;    -   forming a stress dielectric layer over: the first gate, the        first source/drain regions, the second gate, the second spacers        and the second source/drain regions; whereby said stress        dielectric layer serves to puts stress on the first channel        region on the substrate close to the first gate.

Another example embodiment of the invention is a method of fabricationsemiconductor device; comprising the steps of:

-   -   providing a substrate having a first region and a second region;    -   providing a first gate, first spacers on the first gate        sidewalls; first source/drain regions in the first region        adjacent to the first spacers; providing first S/D silicide        regions over the first source/drain regions;    -   providing a second gate, second spacers on the second gate        sidewalls; second source/drain regions in the second region        adjacent to the second spacers; providing second S/D silicide        regions over the second source/drain regions;    -   forming a conformal dielectric layer over the substrate at least        the first region and the second region;    -   forming a non-conformal dielectric layer over the conformal        dielectric layer; the non-conformal dielectric layer is thicker        over the second cap and first cap and the substrate than over        the second and first spacer sidewalls;    -   removing a first thickness of the non-conformal dielectric layer        in the first region; using an etch, to expose the conformal        dielectric layer over the first spacers;    -   removing the first spacers using an etch;    -   removing the non-conformal dielectric layer;    -   forming a stress dielectric layer which serves to puts stress on        the stress on the substrate close to the first gate where the        first spacers were removed in the first region thereby enhance        the first device performance.

An aspect of this embodiment is wherein the first region is a NFETregion and the second region is a PFET region; and the stress dielectriclayer produces a compressive stress on the NFET channel in a uni-axialdirection; and the channel has a 110 crystal orientation.

An example embodiment of the invention is a semiconductor devicecomprises:

-   -   a substrate having a first region and a second region;    -   a first gate, first source/drain regions in the first region        adjacent to the first spacers; providing first S/D suicide        regions over the first source/drain regions;    -   a second gate over the second region, second spacers on the        second gate sidewalls; second source/drain regions in the second        region adjacent to the second spacers; second S/D suicide        regions over the second source/drain regions;    -   a conformal dielectric layer over the second gate and the second        spacers, the second S/D silicide regions, and the first S/D        silicide regions;    -   a stress dielectric layer over the sidewalls of the first gate        and over the substrate adjacent to the first gate; the stress        dielectric layer which serves to puts stress on the stress on        the substrate close to the first gate which does not have first        spacers thereby enhance the first device performance;    -   the stress dielectric layer over the sidewalls of the second        spacers and the second gate.

An aspect of this embodiment is wherein the first region is a NFETregion and the second region is a PFET region; the stress dielectriclayer is a tensile stress layer; and the stress dielectric layerproduces a compressive stress on the NFET channel in a uni-axialdirection; and the NFET channel has a 110 crystal orientation.

The above and below advantages and features are of representativeembodiments only, and are not exhaustive and/or exclusive. They arepresented only to assist in understanding the invention. It should beunderstood that they are not representative of all the inventionsdefined by the claims, to be considered limitations on the invention asdefined by the claims, or limitations on equivalents to the claims. Forinstance, some of these advantages may be mutually contradictory, inthat they cannot be simultaneously present in a single embodiment.Similarly, some advantages are applicable to one aspect of theinvention, and inapplicable to others. Furthermore, certain aspects ofthe claimed invention have not been discussed herein. However, noinference should be drawn regarding those discussed herein relative tothose not discussed herein other than for purposes of space and reducingrepetition. Thus, this summary of features and advantages should not beconsidered dispositive in determining equivalence. Additional featuresand advantages of the invention will become apparent in the followingdescription, from the drawings, and from the claims.

BRIEF DESCRIPTION OF THE DRAWINGS

The features and advantages of a semiconductor device according to thepresent invention and further details of a process of fabricating such asemiconductor device in accordance with the present invention will bemore clearly understood from the following description taken inconjunction with the accompanying drawings in which like referencenumerals designate similar or corresponding elements, regions andportions and in which:

FIGS. 1 through 6 are cross sectional views for illustrating a methodfor manufacturing a transistor according to a first example embodimentof the present invention.

FIG. 7 is cross sectional view for illustrating a method formanufacturing a transistor according to a second example embodiment ofthe present invention.

DETAILED DESCRIPTION OF THE EXAMPLE EMBODIMENTS First Example Embodiment

The example embodiments of the present invention will be described indetail with reference to the accompanying drawings. The exampleembodiments provide methods of applying a stress on a channel of an MOStransistor using a stress layer in silicide process. Preferably, thesource drain regions have a silicide contact layer thereover. Anembodiment removes spacers from a gate and forms a stress layer on oradjacent to the gate. The spacers can be removed from either the PMOS orthe NMOS transistor.

A. Substrate has a NFET Region and a PFET Region

As shown in FIG. 1, we provide a substrate having a NFET region 12, aPFET region 14 and an optional peripheral region 16. The substrate canhave isolation region(s) 24 at least between the NFET region 12, thePFET region 14 and the peripheral region 16.

In the NFET region, we provide a NFET transistor that can be comprisedof NFET gate dielectric 29, a NFET gate 30, NFET cap 32, a NFET spacers28 on the NFET gate 30 sidewalls; NFET source/drain regions 25 in theNFET region adjacent to the NFET spacers 28. We provide NFET S/Dsilicide regions 26 over the NFET source/drain regions 25 and the NFETcap 32 preferably comprised of silicide. The NFET transistor has a NFETchannel under the NFET gate. A NFET channel is in the NFET region underthe NFET gate.

In the PFET region 14, we provide a PFET transistor that can becomprised of a PFET gate dielectric layer 37, a PFET gate 38, PFET cap40, PFET spacers 36 on the PFET gate 38 sidewalls. We provide PFETsource/drain regions 33 in the PFET region 14 adjacent to the PFETspacers 36. PFET S/D suicide regions 34 are formed over the PFETsource/drain regions 33. The PFET cap 40 is preferably comprised of asilicide. A PFET channel is in the PFET region under the PFET gate.

In the peripheral region, we provide peripheral gate structure 49 overthe peripheral region 16. The peripheral gate structures are comprisedof a peripheral gate 40, peripheral spacer 44 and peripheral cap 48.

The substrate has an (peripheral) isolation region 24 over at least aportion of the peripheral region 16; and the peripheral gate structure49 can be over the isolation region.

The structures can be made using a salicide process.

B. Conformal Dielectric Layer

Referring to FIG. 2, we form a conformal dielectric layer 52 (about orsubstantially uniform thickness) over the substrate at least the NFETregion 12, the PFET region 14 and the peripheral region 16. Theconformal dielectric layer preferably has about uniform thickness.

The conformal dielectric layer 52 can be comprised of oxide or siliconoxynitride (SiON) and can have a thickness between 50 and 100 angstroms.

C. Non-Conformal Dielectric Layer

We then form a non-conformal dielectric layer 54 over the conformaldielectric layer 52. The non-conformal dielectric layer can be comprisedof nitride or SiC. A nitride non-conformal dielectric layer can beformed using a PECVD process.

The non-conformal dielectric layer 54 is thicker over about horizontalsurfaces than over sloped or vertical surfaces. The non-conformaldielectric layer 54 can be between 150% and 400% thicker over abouthorizontal surfaces than over sloped or vertical surfaces. The tops ofthe gates and the substrate are about horizontal. The spacer sidewallsare sloped.

The non-conformal layer 54 is thicker over the PFET cap 40 and NFET cap32 and the substrate than over the PFET and NFET spacer 36 28 sidewalls.

For example, the non-conformal layer 54 can have a thickness between 300and 400 angstroms over the PFET cap 40 and NFET cap 32 and thesubstrate; and a thickness between 100 and 200 angstroms over the PFETand NFET spacer 36 28 sidewalls.

D. Remove a First Thickness of the Non-Conformal Nitride Layer in theNFET Region As shown in FIG. 3, we remove a first thickness (portion) ofthe non-conformal nitride layer 54 in the NFET region 12 to expose atleast a portion of the conformal dielectric layer 52 over the NMOSspacers 28.

A photoresist layer 56 can be formed over the non-NMOS regions (e.g.PMOS region 14 and peripheral region 16).

The etch can be an isotropic etch such as a wet etch or Chemical DownStream Etch (CDE).

The first thickness is between about 33 and 66% of the maximum thicknessof the non-conformal nitride layer 54.

Due to the poor step coverage of the non-conformal layer over thespacers, the non-conformal layer is etched away before the non-conformallayer over the horizontal surfaces (e.g., cap, silicide regions 26,isolation regions 24, etc.).

Next, we remove the NMOS spacers 28.

An example option is shown in FIGS. 4 and 5.

E. Remove the Conformal Dielectric Layer Over the NMOS Spacers

FIG. 4 shows the PFET mask 56 over the PFET region 14 and the peripheralregion 16. We remove the exposed conformal dielectric layer 52 over theNMOS spacers 28 to expose the NMOS spacers 28. The conformal dielectriclayer 52 can be removed using an isotopic etch.

F. Remove the NMOS Spacers

As shown in FIG. 5, we etch the NMOS spacers 28. The etch can be anisotropic etch that is selective to the spacer material. The etchpreferably exposed the substrate surface immediately adjacent to thegate 30.

Then we remove the mask 56.

G. Remove the Non-Conformal Nitride Layer

As shown in FIG. 5, we remove the non-conformal layer 54. Thenon-conformal nitride layer 54 can be removed using an etch selective tooxide.

The silicide regions 26 34 are protected by the conformal dielectriclayer 52 during this nitride etch.

H. Form a Tensile Dielectric Layer

As shown in FIG. 6, we form a tensile dielectric layer 60 (e.g., tensilestress nitride) which serves to put a compressive stress on thesubstrate close to the gate (where the spacers 28 used to be) in theNMOS region 12, which in turn cause a tensile strain in the NMOS channelregion (Si below Poly 30), thereby enhance the NMOS transistorperformance. The tensile dielectric layer can serve as a contact etchstop liner (ESL).

The PMOS transistor device is affected less than the NMOS device becausethe PMOS spacers 36 separate and space the tensile nitride layer 60 fromthe substrate under the PMOS spacers 36 and the PMOS channel region.

The tensile dielectric (e.g., nitride) layer causes a tensile stress ina channel region of the NMOS transistor.

The stress is preferably in a Uni-axial direction only. A preferredchannel has a 110 crystal orientation. Uni-axial strain means the strainis in X and Y directions, not in the Z direction.

A feature of the embodiment is that because the spacers are removed, thestressor is nearer to the channel thus enhancing the strain effect.

The device can be finished using conventional process such as forming aILD layer, contacts, and subsequent levels of IMD and interconnects.

Alternate Embodiment

FIG. 7 shows an alternate embodiment where the spacers 36 on the PMOSgate device 38 40 are removed. The process for this embodiment can besimilar to the first embodiment by masking the non-PMOS regions andremoving the PMOS spacers 36. Stress layer 61 is formed over thesubstrate surface. For this PMOS embodiment, the stress layer 61 is acompressive film.

The stress layer 61 preferably puts a tensile stress on the substratenear the PMOS gate, which in turn causes a compressive strain on thePMOS channel (Si below Poly 38). This enhances the PMOS transistor.

A. Non-Limiting Example Embodiments

In the above description, numerous specific details are set forth suchas flow rates, pressure settings, thicknesses, etc., in order to providea more thorough understanding of the present invention. Those skilled inthe art will realize that power settings, residence times, gas flowrates are equipment specific and will vary from one brand of equipmentto another. It will be obvious, however, to one skilled in the art thatthe present invention may be practiced without these details. In otherinstances, well known process have not been described in detail in orderto not unnecessarily obscure the present invention.

Although this invention has been described relative to specificinsulating materials, conductive materials and apparatuses fordepositing and etching these materials, it is not limited to thespecific materials or apparatuses but only to their specificcharacteristics, such as conformal and nonconformal, and capabilities,such as depositing and etching, and other materials and apparatus can besubstituted as is well understood by those skilled in themicroelectronics arts after appreciating the present invention

Unless explicitly stated otherwise, each numerical value and rangeshould be interpreted as being approximate as if the word about orapproximately preceded the value of the value or range.

Given the variety of embodiments of the present invention justdescribed, the above description and illustrations show not be taken aslimiting the scope of the present invention defined by the claims.

While the invention has been particularly shown and described withreference to the preferred embodiments thereof, it will be understood bythose skilled in the art that various changes in form and details may bemade without departing from the spirit and scope of the invention. It isintended to cover various modifications and similar arrangements andprocedures, and the scope of the appended claims therefore should beaccorded the broadest interpretation so as to encompass all suchmodifications and similar arrangements and procedures.

1. A device comprising: a substrate with first and second activeregions; a first transistor of a first type disposed in the first activeregion, wherein the first transistor comprises first diffusion regionsadjacent to a first gate, the first gate comprises exposed gatesidewalls; a second transistor of a second-type disposed in the secondactive region, wherein the second transistor comprises second diffusionregions adjacent to a second gate, the second gate comprises sidewallspacers; and a stress layer comprising a first stress disposed over thefirst and second active regions contacting the first and secondtransistors, wherein the stress of the stress layer affects the secondtransistor less than the first transistor.
 2. The device of claim 1wherein: the first stress comprises a tensile stress, the first-typecomprises n-type and the second type comprises p-type; or the firststress comprises a compressive stress, the first-type comprises p-typeand the second type comprises n-type.
 3. The device of claim 1 comprisesa liner lining the second region between the stress layer and the secondtransistor and the first diffusion regions.
 4. The device of claim 3wherein: the first stress comprises a tensile stress, the first-typecomprises n-type and the second type comprises p-type; or the firststress comprises a compressive stress, the first-type comprises p-typeand the second type comprises n-type.
 5. A semiconductor devicecomprising: a substrate prepared with first and second active regions; afirst transistor of a first-type disposed in the first active region; asecond transistor of a second-type disposed in the second active region;and a stress layer comprising a first stress disposed over the first andsecond active regions over the first and second transistors, wherein thefirst stress of the stress layer affects the second transistor less thanthe first transistor.
 6. The device of claim 5 wherein: the first stresscomprises a tensile stress, the first-type comprises n-type and thesecond type comprises p-type; or the first stress comprises acompressive stress, the first-type comprises p-type and the second typecomprises n-type.
 7. The device of claim 5 wherein: the first transistorcomprises a first gate, first source/drain diffusion regions adjacent tothe first gate and a first channel below the first gate between thefirst source/drain diffusion regions; and the second transistorcomprises a second gate, second source/drain diffusion regions adjacentto the second gate and a second channel below the second gate betweenthe second source/drain diffusion regions.
 8. The device of claim 7wherein: the first stress comprises a tensile stress, the first-typecomprises n-type and the second type comprises p-type; or the firststress comprises a compressive stress, the first-type comprises p-typeand the second type comprises n-type.
 9. The device of claim 7 whereinthe first gate comprises exposed sidewalls and the second gate comprisessidewall spacers, the sidewall spacers cause the first stress of thestress layer to affect the second transistor less than the firsttransistor.
 10. The device of claim 9 comprises a liner lining thesecond region between the stress layer and the second transistor and thefirst source/drain diffusion regions.
 11. The device of claim 5comprises a liner lining the second region between the stress layer andthe second transistor and first source/drain diffusion regions of thefirst transistor.
 12. An integrated circuit (IC) comprising: a substratewith first and second active regions; an isolation region separating theactive regions; first and second transistors disposed in the first andsecond active regions, wherein the first transistor comprises afirst-type and the second transistor comprises a second type; and astress layer comprising a stress disposed over the first and secondactive regions over the first and second transistors, wherein the stressof the stress layer affects the second transistor less than the firsttransistor.
 13. The IC of claim 12 wherein: the stress comprises atensile stress, the first-type comprises n-type and the second typecomprises p-type; or the stress comprises a compressive stress, thefirst-type comprises p-type and the second type comprises n-type. 14.The IC of claim 13 wherein: the first transistor comprises a first gate,first source/drain diffusion regions adjacent to the first gate and afirst channel below the first gate between the first source/draindiffusion regions; and the second transistor comprises a second gate,second source/drain diffusion regions adjacent to the second gate and asecond channel below the second gate between the second source/draindiffusion regions.
 15. The IC of claim 14 wherein: the stress comprisesa tensile stress, the first-type comprises n-type and the second typecomprises p-type; or the stress comprises a compressive stress, thefirst-type comprises p-type and the second type comprises n-type. 16.The IC of claim 14 wherein the first gate comprises exposed sidewallsand the second gate comprises sidewall spacers, the sidewall spacerscause the stress of the stress layer to affect the second transistorless than the first transistor.
 17. The IC of claim 16 comprises a linerlining the second region between the stress layer and the secondtransistor and the first source/drain diffusion regions.
 18. The IC ofclaim 12 comprises a liner lining the second region between the stresslayer and the second transistor and first source/drain diffusion regionsof the first transistor.